GenX-90P
Ultra High-Performance, 90kV, Compact X-Ray System
High Quality NDT X-Ray Imaging Solutions for PCB Analysis, Medical Device Inspection, Porosity Analysis and Custom Applications.
Designed Specifically for Quality Control, Production Process Validation, Research and Development, and MRO applications.
Detect a wide range of manufacturing/process defects including BGA, QFN and IGBT attachment, PTH filling, interfacial voiding, die attach, component cracking, mis-alignment, and bridging with automated inspection routines resulting in Pass/Fail Analysis.
- BGA Inspection/Analysis
- Counterfeit Inspection
- Porosity/Voiding Detection
- Medical Device Inspection
- Wire Bond Inspection
- LED Inspection
Main features include:
- Truly Remarkable Image Clarity with proprietary HD Camera and Software
- Compact System, PCB sizes up to 21”(533mm) X 17.5” (445mm)
- Customizable Flat Panel Detectors or Image Intensifier options to meet your application requirements
- 90kV, 8 Watt, 4um X-Ray tube, 0.18mA with Magnification up to 1100X
- Programmable 4 Axis ( X,Y, Z1/Z2) fully motorized Motion Control
- BGA/QFN/Flip Chip Software Pass/Fail – Sphere Size - Void * 3D Gray Scale Option
- Wide Range of Analysis and Enhancement Tools Powered by PXI Technology
- Frame Averaging, Quad View Analysis, Image Filters, Reporting, More…
- Tilt/Rotate Oblique View and LED Targeting System Options
- Flexible and EASY-To-OPERATE system controls and Software
- Easily Upgrades to 130kV X-Ray as your needs change
- Engineered for Low Maintenance and Trouble Free Operation
- Quality Built Made in the U.S.A. Supported Worldwide
PDR GenX-130P
High Powered Performance, 130kV, Compact X-Ray System
High Quality NDT X-Ray Imaging Solutions for PCB Analysis, Medical Device Inspection, Porosity Analysis and Custom Applications.
Designed Specifically for Quality Control, Production Process Validation, Research and Development, and MRO applications.
Detect a wide range of manufacturing/process defects including BGA, QFN and IGBT attachment, PTH filling, interfacial voiding, die attach, component cracking, mis-alignment, and bridging with automated inspection routines resulting in Pass/Fail Analysis.
- BGA Inspection/Analysis
- Counterfeit Inspection
- Porosity/Voiding Detection
- Medical Device Inspection
- Wire Bond Inspection
- LED Inspection
Main features include:
- Truly Remarkable Image Clarity with proprietary HD Camera and Software
- Compact System, PCB sizes up to 21”(533mm) X 17.5” (445mm)
- Customizable Flat Panel Detectors or Image Intensifier options to meet your application requirements
- 130kV, 16W, 5um to 6um X-Ray tube, 0.18mA with Magnification up to 665X
- Programmable 4 Axis ( X,Y, Z1/Z2) fully motorized Motion Control
- BGA/QFN/Flip Chip Software Pass/Fail – Sphere Size - Void * 3D Gray Scale Option
- Wide Range of Analysis and Enhancement Tools Powered by PXI Technology
- Frame Averaging, Quad View Analysis, Image Filters, Reporting, More…
- Tilt/Rotate Oblique View and LED Targeting System Options
- Flexible and EASY-To-OPERATE system controls and Software
- Engineered for Low Maintenance and Trouble Free Operation
- Quality Built Made in the U.S.A. Supported Worldwide
