PDR - Gopalam Embedded Systems

PDR designs, manufactures, and distributes IR Rework Stations, Industrial X-Ray Inspections Systems, and IR Thermal Test equipment for the electronics component and PCB assembly industry. Based in the UK and USA, they also have regional technology centers in France.

PDR was formed in 1985 by Philip Gibbs, David Lowrie and Roger Gibbs and their first pioneering IR system was launched in 1987. Over 37+ years later, PDR is still at the forefront of SMD rework, X-Ray and Test technologies working with many of the world's top names in

Mobile Phone, PDA, Tablet, Laptop, Desktop, Server repair.
Consumer electronics, Set-top, TV, Game Console repair.
Aerospace, Weapons, Avionics, Automotive, Transport electronics.
Control and systems repair, R&D, assembly and repair rework.

We at ESA group are a channel partner for PDR and support customers, provide Sales and Technical Support service. There are other regional offices plus a global network of professional sales/support partners who have successfully supplied over 4500 systems to the world's electronics industry since 1987.

There are many different Rework, X-Ray and Test System choices to choose from but customers feel comfortable to choose PDR, returning in time and time again to benefit from their advanced precision thermal engineering Rework Systems, X-Ray imaging quality, and highly accurate and affordable Thermal Testing Solutions.

PDR IR-Q3 - SEMI-AUTOMATIC ASSISTED REWORK FOR XL PCBS

Semi-Automatic Assisted Rework

Advanced Focused IR component heating
Automatic Component Removal and Placement
Quartz IR PCB preheating with up to 3 zones
2” Split Beam prism system for simultaneous PCB/component viewing
Precision Components Pick and Placement up to 5um
Precision PCB handling
Component Nest/Flux Application Facility
Closed Loop Non-Contact Temperature Sensing
Advanced Automatic Thermal Process Control
Reflow Process Observation Camera
PCB Forced Air Cooling

Applications
Desoldering, placement and soldering of all types of surface-mounted devices (SMD) BGA, QFN, LED, CSP, 0201, 01005

Technical Data

Bench Area: 1400mm (w) x 600mm (d)
Weight: 75kg
Warranty: 2 years
Voltage Frequency: 208-240 volts 50/60Hz, up to 3.5KW
Top Heater Power: 150W Focused Infrared up to Ø70mm Spot
PCB Preheater Power: 3250W Dark IR
PCB Preheater Heating Area Size: 14.1 x 9.4”/360 x 240mm
Number of PCB Preheater Zones: 3 Zones
Spot Size Included: F700 (Ø 25-70mm), F200 (Ø 10-28mm)
Component Placement: 2” Automatic Split Beam Prism Alignment
Placement Accuracy: Up to 10um
Component Temperature Sensing: Non-Contact IR Sensor
PCB Temperature Sensing: Non-Contact IR Sensor
Max PCB Size: 12 x 18”/300 x 450mm
Max Component Size: 2.1 x 2.1”/55 x 55mm
Min Component Size: 2 x 2mm
Reworkable Area: 10 x 15.9”/254 x 406mm
Number of TC Channels: 4
Operating Software: PDR’s Thermoactive Software Suite suitable for Windows 10+

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PDR IR-E6 - BGA/SMT REWORK STATION FOR XL PCBS

Description

The PDR IR-E6 SMD/BGA rework station, using PDR’s patented Focused IR technology, has been specifically designed to cope with the challenges of repairing today’s PCB assemblies.

The system is tool free, gas free, instantly/precisely controllable, clean, modular, upgradeable and produces 100% yield BGA rework without any complications. It provides the extremely high levels of profiling and process control necessary for the effective rework of even the most advanced packages, including SMDs, BGAs, CSPs, QFNs, Flipchips and is ready for 0201 and lead-free applications.

The IR-E6 is well specified yet can be easily configured to your exact requirements, with a good range of advanced features to choose from, allowing the operator to quickly and safely rework all types of components without overheating the component, adjacents or the PCB. It uses all the proven attributes of PDR’s Focused IR technology, first introduced in 1987 and now used worldwide by over 4500 customers.

Applications
Desoldering, placement and soldering of all types of surface-mounted devices (SMD) BGA, QFN, LED, CSP, 0201, 01005

Features

Gantry Mounted Advanced Focused IR component heating
Large Quartz IR PCB preheating with 3 zones
24”/620mm PCB Capacity
Split Beam prism system for simultaneous PCB/component viewing
Precision Components Pick and Placement up to 10um
Precision PCB handling
Component Nest/Flux Application Facility
Closed Loop Non-Contact Temperature Sensing
Advanced Automatic Thermal Process Control
Reflow Process Observation Camera
PCB Forced Air Cooling

Technical Data

Bench Area: 2000mm (w) x 1000mm (d)
Weight: 100kg
Warranty: 2 years
Voltage Frequency: 208-240 volts 50/60Hz, up to 3KW
Top Heater Power: 150W Focused Infrared up to Ø70mm Spot
PCB Preheater Power: 3200W Dark IR
PCB Preheater Heating Area Size: 500x240mm
Number of PCB Preheater Zones: 3 Zones
Spot Size Included: F700 (Ø 25-70mm), F200 (Ø10-28mm)
Component Placement: Split Beam Prism Alignment
Placement Accuracy: Up to 10um
Component Temperature Sensing: Non-Contact IR Sensor
PCB Temperature Sensing: Non-Contact IR Sensor
Max PCB Size: 24”/620mm
Max Component Size: 55x55mm
Min Component Size: 01005
Number of TC Channels: 4
Operating Software: PDR’s Thermoactive Software Suite suitable for Windows 8 and Windows 10